Mr. Hogaboom spelled out
the many honors conferred on Dr. Blum, including Honorary Membership in the
A. E. S. and the A. E. S. Research Committee.
Addressing President Warner,
Dr. Blum expressed his gratitude for the honor and explained it as the result
of loyal cooperation of many associates. He then justified the existence of
the Electrochemical Society and other specialized organizations on a two-fold
basis:
(1) The society makes it
possible to increase the specialized knowledge of the members, and
(2) It gives the member
an opportunity to learn as much science outside his immediate field as possible.
Abstracts of the twenty-four
papers presented before the Electrodeposition Division, not including six presented
in joint session with the Industrial Electrolytic Division, will be reported
herewith and in the January issue of PLATINGELECTRODEPOSITION OF COPPER
FROM THE MONOETHANOLAMINE BATHT. L. Rama Char and N. B. ShivaramanCopper
deposits from a complex copper-monoethanolamine solution are smooth, fine-grained,
bright and adherent. The inclusion of Rochelle salt considerably improves its
performance. The optimum conditions are: copper oxalate 60 g/l, monoethanolamine
60 ml/l, Rochelle salt 60 g/l, 2.4 to 4.8 amp/dm2 (22.3 to 44.6 amp/ft2), 2.9
to 4.3 volts, pH 9.5, and 24° C The addition of nitrates has some beneficial
effect.
STUDIES OF THE MECHANISM
OF BRIGHT PLATING IN THE ACID COPPER BATHBacon Ke and Dan TrivichIn
the acid copper bath, polarography shows that thiourea suppresses the maximum
and shifts E1/2 for copper to more negative potentials, while dextrin lowers
the diffusion current, the effects of the two being additive. With brighteners,
the deposits are polycrystalline and bright all over. Thiourea with S35 shows
no localized adsorption on Cu single crystals.
THE ELECTRODEPOSITION OF
COPPER AND NICKELJohn Yeager, Ernest Yeager and Frank HovorltaPolarization
and structural measurements were made for copper and nickel as typical metals
with low and high polarization. A stream of electrolyte was directed past the
electrode to minimize concentration polarization. The build-up and decay of
the polarization following the polarization and interruption of the current
were also determined.
THE EFFECT OF ULTRASONIC
WAVES ON THE ELECTRODEPOSITION OF COPPER W. R. Wolfe, Hyman Chessin, Ernest
Yeager and Frank HovorkaThe effects of ultrasonic waves on the electrodeposition
of copper were determined at frequencies of 200 and 1000 kc/sec with acid plating
baths of various concentrations. Polarization measurements were made by the
direct method, while structural information concerning the deposits were obtained
through X-ray and photomicrographic studies.
A NEW APPROACH TO THE INVESTIGATION
OF ADDITION AGENTSB. I. Parsons and C. A. WinklerThe system under
investigation is a copper-copper sulfate-sulfuric acid bath with gelatin as
addition agent. Changes in cathode polarization in a Haring Cell were determined
with a cathode ray oscillograph. If no addition agent is present the polarization
rises almost instantaneously to 100 mv after the current is switched on, then
slowly increases to 110 mv. When gelatin is present in the electrolyte the polarization
rises to about 20 mv within five seconds, falls to 200 mv during the next ten
seconds of deposition, then slowly increases to the steady state polarization
characteristic of the gelatin concentration.